Interview with Constantia’s Dr. Achim Grefenstein
In November 2019, at the opening of the brand new Constantia Ecoflex plant near Ahmedabad, we first met Dr Achim Grefenstein. While seated together...
Rajoo Engineers unveils new 5-layer co-extruded blown film line
On 9 September, Rajoo Engineers unveiled its Pentafoil five-layer co-extruded blown film line during an open house. The one-day event, held at Rajoo’s manufacturing...
Drinktec 2022 – Ode to excellence in beverage equipment
It has been five years since the last Drinktec edition… This is the world’s leading trade fair in beverage and liquid food. Not surprising...
Syntegon Technology’s solid presence at PackEx 22 Mumbai
German packaging machine manufacturer Syntegon Technology marked an impressive presence at the recently concluded PackEx 2022 that was held in Mumbai. “We have used...
Toppan adds retortable all PP packaging to GL Barrier lineup
Tokyo – 3 October 2022 – Toppan has added to its comprehensive range of GL Barrier¹ brand products centered on transparent barrier films by...
UFlex Chemicals gets India patent for solvent free pigmented adhesive
New Delhi, 6 October 2022 – As one of the global leaders in inks, coatings and adhesives for packaging and labelling applications, the UFlex...
Wraptech showcases newly developed products at PackEx 2022
Mumbai-based form fill seal machine manufacturer Wraptech Machines displayed some of its newly developed solutions at the recently concluded PackEx 2022 that was held in...
Attractive and sustainably packed boxes for Diwali
The Indian festive seasons have arrived and many people have friends and relatives visiting them after a long time. So, do you have any...
Constantia Flexibles to present innovations at PackExpo Chicago
Product safety is the top priority of every pharma packaging solution. Sustainability often plays a secondary role in this process. However, the demand for...
Packaging in the next decade – trends and needs
To throw light on the future of packaging, the PHD Chamber of Commerce and Industry conducted a panel discussion on Packaging in the Next...
